Plating Systems - VCP
Series of Plating systems for electronics and semiconductor advanced packaging
Application
IC Substrate, PCB, semiconductor advanced packaging
Features
Introduced products from South Korea, acknowledged by global customers
Main Spec.
| Board Size | 510mm*610mm-510mm*515mm · Customizable |
| Board Thickness | 0.04mm-1.5mm |
| Plate Thickness | 5μm-30μm |
| Plate Deviation | ±7-10% |
