Coreless Detach Machine
Used in Coreless or ETS IC substrate products to separate Top/Bottom layer, plus dewarpage function
Application
IC Substrate
Features
1. Dewarpage function installed
2. Servo control to prevent scratches
Main Specs.
| Size | 410mm*510mm-513mm*623mm · Customizable |
| Thickness | Core 0.4mm-0.1mm，Panel 0.05mm-0.5mm |
| Productivity | 37.5 s/piece |
| Dewarpage Efficacy | ≤ 5mm |
